Experimental investigation of PCM based round pin-fin heat sinks for thermal management of electronics: Effect of pin-fin diameter
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چکیده
منابع مشابه
Thermal Performance of an Elliptical Pin Fin Heat Sink
Christopher L. Chapman, and Seri Lee Aavid Engineering, Inc. Laconia, New Hampshire 03247 Bill L. Schmidt Silicon Graphics Computer Systems Mountainview, California 94039 Comparative thermal tests have been carried out using aluminum heat sinks made with extruded fin, cross-cut rectangular pins, and elliptical shaped pins in low air flow environments. The elliptical pin heat sink was designed t...
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Heat sinks are widely adopted in electronics cooling together with different technologies to enhance the cooling process. For the small electronics application, the small scale pin fins heat sinks are extensively used to dissipate heat in electronics devices. Due to the limit of space in the small devices, it is impossible to increase heat transfer area. In order to improve the heat transfer pe...
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This paper presents the comparative performance of several surrogate-assisted multiobjective evolutionary algorithms MOEAs for geometrical design of a pin-fin heat sink PFHS . The surrogate-assisted MOEAs are achieved by integrating multiobjective population-based incremental learning PBIL with a quadratic response surface model QRS , a radial-basis function RBF interpolation technique, and a K...
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The Performance of electric vehicle IGPT Pin fin heat sink can be measured by the temperature field and the fluid pressure and other parameters. In order to improve the cooling effect of Pin fin heat sink, diameter, length and distance of the fin was optimized combination. The relationship between pressure drop of the water inlet, outlet and pin fin parameters was analyzed and calculated. It wa...
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Article history: Received 25 May 2015 Received in revised form 27 June 2015 Accepted 2 July 2015 Available online xxxx
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ژورنال
عنوان ژورنال: International Journal of Heat and Mass Transfer
سال: 2018
ISSN: 0017-9310
DOI: 10.1016/j.ijheatmasstransfer.2017.10.008